SS 21
With the rapid evolution of high-frequency systems such as 5G/6G communications, radar sensing, and satellite internet constellations, the RF Front-end Module (FEM) has emerged as a critical determinant of system performance, power efficiency, and operational reliability. This special session focuses on the design methodologies and reliability behavioral modeling of core RF components including Power Amplifiers (PAs), Low-Noise Amplifiers (LNAs), filters, and frequency multipliers and their integration within compact modules.
At the device and circuit levels, this session emphasizes nonlinear device modeling, broadband matching network synthesis, high-efficiency PA architectures, and temperature-induced drift characteristics of filters. From a reliability perspective, it systematically addresses junction temperature reliability, interconnect reliability (e.g., wire bond and solder ball fatigue), device-level degradation mechanisms, and circuit-level reliability evolution.
A central theme of this session is reliability behavioral modeling. We solicit contributions on physics-based models, physics-informed data-driven hybrid models, and machine learning-assisted accelerated life prediction methods aimed at characterizing performance degradation and failure mechanisms of RF modules under multiphysics stress conditions.
We invite original research on RF module design, nonlinear and parasitic effect modeling, multi-stress reliability assessment, behavioral-level simulation, and digital twin frameworks, fostering theoretical innovation and engineering practice at the intersection of RF engineering and reliability science.
